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To protect trade secrets, product parameters are not consistent! Please consult |
| MaterialType | FPC Polyimide |
| Layers | 2layers RA Cu |
| Thickness | 0.15mm |
| Copper | 35um-70um |
| Solermask | Coverlay |
| Silkscreen | White silkscreen |
| Surfacefinish | ENIG+FINGER GOLD |
| Characteristics | 3M;TESA;Stiffeners |
| The actual manufacturing capacity of our plant | |||
| Max Layers | 20Layers | Max Fabrication Size | 1500*500mm |
| Max Thickness | 3.0mm | min hole diameter | 0.1/0.35mm |
| Min Thickness | 0.15mm | Drilling accuracy | +/-0.025mm |
| Max Copper Thickness | 5oZ | PTH Bore Tolerance | +/-0.03mm |
| Surfacefinish |
ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink |
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