PCB manufacturing
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| MaterialType | FR4 TG150-TG170 |
| Layers | 6layers |
| Thickness | 1.0-2.0mm |
| Copper | 35-70um |
| Solermask | Black solermask |
| Silkscreen | White silkscreen |
| Surfacefinish | ENIG |
| Characteristics | Control impedance |
| The actual manufacturing capacity of our plant | |||
| Max Layers | 1-40Layers | Max Fabrication Size | 1250*570mm |
| Max Thickness | 8.0mm | min hole diameter | 0.15/0.35mm |
| Min Thickness | 0.2mm | Drilling accuracy | +/-0.025mm |
| Max Copper Thickness | 1-10oZ | PTH Bore Tolerance | +/-0.03mm |
| Surfacefinish |
ENIG/ OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink |
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TAMINGKEE ELECTRONIC
TEL：0755-89260312 |
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